Introduction:

Some advanced technologies require tight specifications around thickness and total thickness variation without compromising other critical tolerances such as surface finish, subsurface damage and contamination


Challenge:

Achieving next generation accuracy and thickness control requirements is extremely difficult using conventional manufacturing processes

 

Proposed solution

MRF can be used to target a desired thickness and meet tight total thickness variation specifications for: 

  • SOI wafers
  • Coatings
  • MEMS applications