Objective:

Correct thickness uniformity of top Si layer

 

SOI (Silicon-on-Insulator) Wafer

  • Size: 200 mm Φ
  • Material: Silicon

 

The MRF System Configuration

  • Rotational polishing mode
  • 150 mm wheel
  • Large spot to minimize cycle time
  • D20 MRF fluid
  • Low roughness